Transfer Printing Methods for Fabricating Unusual Electronics. Building Usual Thin Film Electronics on Unusual Substrates

      Аннотация: Thin-film electronics refer to devices composed from thin-films of active semiconductors, dielectrics and metallic connects that are deposited over a supporting substrate, frequently silicon or glass. Thin-film electronics are widely used for applications, ranging from solar cells, batteries, transistors, light emitting diodes to sensors. Fabrication of thin-film electronics on nonconventional substrates (e.g., papers, polymers, fabrics and metal sheets) presents exciting opportunities for realizing the next-generation of electronics, such as flexible displays, transparent touchscreen panels, wearable solar cells and bio-integrated electronics. However, fabrication of thin-film electronics on unusual substrates faces a significant challenge due to the mismatch between the device fabrication conditions and the tolerable processing conditions for the nonconventional substrates in terms of maximum temperature and chemical compatibility. To overcome this challenge, the transfer printing methods are developed and introduced here.

Ключевые слова: Transfer Printing Method, Advanced Manufacturing Process, Peel-and-Stick Process, Noncoventional Substrates