Lead-Free Solder Joint’s Size and Configuration Effect. Effect on Mechanical Properties, Microstructure, and Aging Kinetics

      Аннотация: The properties of Lead-Free solder joints continue to change over a very long time while in service. The assessment of long-term service life of electronics packages invariably misses the effect of solder joint size and configuration, and may thus end up to be seriously misleading. One of the goals of this book is to develop a fundamental understanding of the effects of solder joint size on the mechanical properties of microstructure and aging kinetics. This understanding will help in the assessment of the reliability of Lead-Free solder joints.

Ключевые слова: Lead-free solder, mechanical properties, microstructure, Aging Kinetics, Electronics Packages. Reliability, Accelerated Testing, metalization, SAC Alloys